Terminals for power semiconductors (press & surface treatment)
By performing surface treatment in-house, we achieve the appropriate surface condition!
At FineNex, we manufacture and sell terminals for power semiconductors (press and surface treatment), accommodating production from 10,000 units to several hundred million units per month. We produce terminals used in power semiconductor-related module components through press processing such as punching and bending. We have established a unique technology for gold plating only on necessary parts by performing Au plating on a Ni base, enhancing our analytical capabilities and quality control, and contributing to the promotion of energy-saving products. 【Features】 - Produced through press processing such as punching and bending - Molds can be proposed in-house (some outsourced) - Terminals for power semiconductors are wire bonded with gold or aluminum - Achieving suitable surface conditions by performing surface treatment in-house - Established a unique technology for gold plating only on necessary parts by performing Au plating on a Ni base - Enhanced analytical capabilities and quality control, contributing to the promotion of energy-saving products *For more details, please refer to the related links or feel free to contact us.
- Company：ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
- Price：Other
